The operator has several opportunities to optimize and control his cleaning process.
The goal is to achieve optimal cleaning quality for a long-term reliability of the electronic components in the field and for the preparation of subsequent processes such as coating, moulding or wire bonding in a cost efficient way.
In order to achieve this goal, various approaches can be applied. In the cleaning and rinsing stage, bath monitoring and cleaning agent recovery and return can be implemented. Followed by analyzing the cleaned parts.