Cleaning Processes

Spray Process

Cleaning in single chamber batch spray machines

In single chamber spray systems, cleaning occurs according to the dishwasher principle. All of the process steps are executed in the same process chamber. The cleaning medium is sprayed onto the electronic assemblies through nozzle fittings or rotating spray arms. The cleaning effect is generally not achieved through spray jet pressure, as with inline processes, but rather via the volume of cleaning medium passed over the substrates.

This machine type for PCB assemblies is suitable for small or medium production rates and requires a small footprint in the production area.

If you have questions regarding the different cleaning mechanics/ process types or would like to conduct cleaning trials with different cleaning machines in our Technical Center, please contact our Process Engineers.

Contact us:

Phone: +49 (841) 635-26

techsupport(at)zestron.com