Power Electronics Cleaning

BGA Cleaning After Balling

During the balling process of BGAs and Micro BGAs, the external connections are formed at the base.  Normally, premade balls are soldered onto the base using a flux paste. By implementing a cleaning process, the danger of electrochemical migration, leakage currents and corrosion can be reduced.

cleaners for bga packages
cleaning agents for bga packages
cleaning media for bga packages

Phone: +49 (841) 635-26

techsupport(at)zestron.com

Products for BGA Cleaning

Water based: