Stencil Underside Wiping

Stencil Underside Wipe Cleaning in Printers

In addition to automated stencil cleaning, the stencil underside wipe process in SMT printers is an important factor for optimal and consistently excellent print results.

An important aspect of underside wipe cleaning is the cleaning agent itself.  It must provide excellent cleaning power, low consumption and high compatibility with solder paste.  During the underside wipe process, the flow of cleaning agent through the apertures and its interaction with the solder paste cannot be prevented.  An incompatible cleaner, such as for example IPA (Isopropyl alcohol), can affect the viscosity of the solder paste and therefore influence the print result, i.e. the solder paste deposit.  Additionally, the consumption of IPA is very high due to evaporative losses.

Media for stencil underside wiping in printer
Agents for stencil underside wiping in printer

Cleaning agents that have been specifically designed for underside wipe processes clean well, feature low consumption and do not affect the viscosity of the solder paste.  For this purpose, ZESTRON offers water as well as solvent based underside wipe cleaning agents that have been specifically developed for cleaning steel stencils as well as nano coated stencils in the printer. These products have been approved by leading SMT printer and stencil manufacturers.

Our Application Technology department is pleased to help you find the optimal process for your application! 

Phone: +49 (841) 635-26

techsupport(at)zestron.com

Products for underside wipe cleaning

MPC® Technology:

Solvent-based: