Surface analysis at ZESTRON

ZESTRON’s Analytical Centers are outfitted with the state-of-the-art equipment to support a large variety of analytical test methods to analyze the surface cleanliness of electronic assemblies for subsequent coating and bonding processes.

The following test procedures are available to determine the cleanliness, coatability and bondability:

• Ionic Contamination determination
• Qualitative cation and anion determination
• Optical (80 times) and digital (up to 1000 times) microscope
• Thermal analysis (Qualitative)
• Surface energy via contact angle measurement or ink test
• Surface resistance measurement
• ZESTRON® Flux Test for the detection of flux residues
• ZESTRON® Resin Test for the detection of resin residues

Assemblies can thus be tested accordingly to international standards (e.g. IPC Standards and J-STD 001D). 

Furthermore, ZESTRON is able to test assemblies for weak points with regard to their resistance to climatic conditions. The climatic reliability is determined through:

• Climatic storage (-40°C to +100°C, 40% to 93% atmospheric humidity)
• Coating Reliability Test (CoRe Test)
• Stress screening by Burn In (max. temp. 300°C)