Cleaning Applications
For every major cleaning application in the SMT line ZESTRON offers specially developed cleaning agents:
SMT-Line | Application | Contamination | Reasons for Cleaning |
1 | - Flux residues of lead-based solder pastes | - achieve optimal conditions for subsequent wire bonding and moulding processes | |
2 | - Solder paste on the stencil (Waferbumping) | - Avoid print failures - Prevent corrosion, electrochemical migration and leakage currents | |
3 | - Solder paste | - Consitent print quality | |
4 | - adhesives | - clean needles guarantee accurate dispensing results | |
5 | - Misprinted solder paste | - Reintroduced misprinted boards to the process | |
6 | - Baked in flux residues | - avoid re-contamination of the assemblies | |
7 | - Flux residues | - Prevent corrosion, electrochemical migration and leakage currents |
Please click on the relevant application on the picture to achieve further information:
If you are searching for a new cleaning process, you can test all ZESTRON products free of charge at our three Technical Centers in Europe, America or Asia. The Technical Centers are equipped with more than 35 cleaning machines from leading system manufacturers. Experienced process engineers will support you during the cleaning trials to find the optimal cleaning process for your SMT or Semicon Backend application.
Further information:
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