Although cleaning the stencils considerably improves the print quality, misprinted PCBs cannot be completely avoided. Misprint cleaning is primarily intended for the removal of solder paste that has been applied incorrectly or has been smudged.

The effective removal of misprinted solder paste and adhesive can oftentimes become more cost-effective than their disposal. This is particularly true for double-sided populated assemblies, which due to their added value need to reintroduced to the process after cleaning.

In the case of already populated assemblies it is not only the removal of solder paste residues that is of importance, but also the removal of flux residues from the soldering process on the already populated side.

The misprint cleaning of PCBs can be easily accomplished by common stencil cleaning process.

Further Information:

• Cleaning of stencils and screens
• PCB cleaning
• Technical articles on misprint cleaning
• Cleaning Technology for misprint cleaning