Solder pastes, SMT adhesives as well as thickfilm pastes, which are most commonly used during the assembly process, are typically applied via screens and stencils. Residues of solder paste and SMT adhesive that are left behind, especially in apertures can lead to print failure.

For every stencil and screen cleaning application, ZESTRON offers either water-based MPC® cleaners or solvent-based cleaning solutions.

When looking for a stencil cleaning process,  various spray-in-air cleaning systems as well as ultrasonic cleaning systems of leading equipment manufacturers may be considered and tested in our Technical Centers under field conditions.

Further Information:

• Stencil cleaning inside the printer
• Misprint cleaning
• Technical articles about stencil cleaning
• Cleaning Technology for stencil/screen cleaning