Today, the cleaning of metal masks or stencils in the SMT printer is widespread. Automatic stencil cleaning ensures stable processes and the print quality is increased.

Underside wipe cleaning agnets usually get through the apertures and interacts with the solder paste. A non-compatible cleaner such as IPA (Isopropanol) can have an adverse effect on the soldering paste stability. During the use of IPA a significant amount also evaporates due to the high volatility.

However, a suitable stencil cleaner  should be implemented to remove the solder paste from the stencil underside, the amount used is reduced by 3 to 6 times compared to IPA. ZESTRON therefore offers water-based as well as solvent-based agents especially suitable for cleaning SMT stencils in the printer. These were developed and approved by leading SMT printer manufacturers such as DEK, MPM and EKRA.

Further Information:

• Cleaning of stencils and screens
• Technical articles about stencil cleaning