Evaporated flux and gas emissions from the solder mask are deposited on the inner surface of the reflow oven during the soldering process. To avoid re-contamination of the assemblies, oven manufacturers recommend regular maintenance cleaning.

ZESTRON recommends the use of VIGON®  RC 101. Unlike IPA, VIGON®  RC101 is a water-based product and therefore has no flash point.

To reduce the reflow oven downtime even further, VIGON®  RC 101 has been formulated for usage on warm surfaces. A quick and efficient cleaning process is guaranteed, even for baked-on flux residues.

Further Information:

• Cleaning of condensation traps
• Wave solder oven cleaning