ZESTRON offers cleaning solutions for semiconductor packaging applications. Cleaning applications in the semiconductor sector are often associated with the chip packaging process.

Especially regarding the production of High Power Packages, BGAs, and Flip Chips where solder paste or tacky fluxes are used for the Die attach, defluxing is important to get proper wire bonding and moulding results.

In addition to BGA and Flip Chip cleaning, ZESTRON offers solutions for lead frame cleaning , as well as various cleaning processes around wafer bumping applications.

Further Information:

• Leadframe Cleaning
• Cleaning during Wafer Bumping
• Cleaning of High Power Packages
• Flip Chip Cleaning
• BGA balling cleaning