High power packages and discrete devices such as for example MOSFETs, IGBTs, IGTCs, Power Hybrids and DCBs are usually clip bonded and / or wire bonded after the die attach process.

Clip bonding is an exception to the die attach process. Here attachment is not achieved by means of adhesives or flux-free soldering, but through means of lead-based soldering pastes. The packages are subsequently wire bonded and moulded.

The integration of a cleaning step is highly recommended, in order to create ideal conditions subsequent wire bonding and moulding process.

Further Information:

• Technical Articles