Leadframe cleaning is necessary in many cases prior to the Die attach process. Leadframes are usually cut from thin copper sheets, stamped and refined via galvanic processes. In case of very thin and homogenous contamination layers, plasma is often used for cleaning applications.

However, cleaning with plasma alone is not sufficient to remove heavier contamination caused by stamping and cutting oils from the lead frames.

A wet  cleaning process is recommended to achieve ideal conditions for the die attach process by gluing and for further production steps such as wire bonding and moulding.