VIGON® PM Series - New Cleaning Agents for Power Modules

ZESTRON introduces the new water-based VIGON PM series, which was specifically developed for the defluxing of Power Modules and other descrete devises after die attach.

While VIGON® PM 101 is a slightly alkaline cleaning agent, VIGON® PM 102 is a pH-neutral medium. Both cleaning agents provide residue-free, activated Cu surfaces and thereby ensure optimal surface cleanliness and conditions for subsequent wire bonding or moulding processes. The VIGON® PM series has a very good compatibility with dies and copper/nickle and does not attack their passivation.

Based on the MPC® Technology VIGON® PM 101 and VIGON® PM 102 provide a high bath loading capability, can easily be filtered and thus lead to an extended bath life and reduced cleaning agent costs. Due to their surfactant-free formulation, they can be easily rinsed at room temperature.

The VIGON® PM products have no flash point and do not foam. Therefore they can be applied in all spray-in-air equipment, such as inline or batch systems. Both products are biodegradable, formulated free of halogenated compounds and therefore very environmentally friendly.

For further information please contact info@zestron.com.

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