Cleaner Type

Process

Contamination

Area of Specific Application

b-stage adhesives

Fluxes & Solder Pastes after Soldering

Eutectic

Lead-free

Lead-based

Water-based

For components
with low
standoff

Optimized bath life time

Spray-in-Air
(inline & batch)

All-round-product

For components
with low
standoff (Flip Chip/BGA)

Removes b-stage adhesive from stencil underside

solvent based

All-round-product

1-Chamber
Vacuum with
Vapor Rinse

For water and
pH-sensitive
parts

Co-Solvent with
Vapor Rinse