Stencil Cleaning

VIGON SC

For the removal of solder pastes and SMT adhesives

VIGON® SC is a water-based cleaning medium designed for cleaning SMT stencils in spray-in-air equipment. Based on the MPC® Technology, VIGON® SC reliably removes solder pastes and SMT adhesives in a single process. Furthermore, VIGON® SC can be used for cleaning misprinted PCBs. Depending on the flux type, this also applies to double-sided, populated circuit boards. VIGON® SC can also be used for stencil underside wiping in SMT printers.

Advantages compared to other stencil cleaners:

  • Dries twice as fast as water, therefore, the process time can be significantly reduced
  • Excellent filterability and therefore a long bath life as well as low maintenance costs
  • Surfactant-free formulation does not leave any residues on the surface or in the cleaning equipment
  • Applicable in spray-in-air systems, ultrasonics dip tanks and printers
  • Has no flash point and can be used without explosion-proof equipment
  • Low odor, pH-neutral, highest operational safety

Technology:

Contamination:

  • Solder pastes
  • Flux residues

Available process optimization products: