Visual Inspection

Post solder flux residues remaining on electronic assembly surfaces can adversely affect their functional reliability as a result of electrochemical migration, dendritic growth and leakage current. Thus, it is critical to remove these residues in order to ensure the highest level of product reliability. A simple and fast conductable method of assessing surface cleanliness is visual inspection analysis. This is a non-destructive cleanliness assessment method defined within IPC standards.