We offer water based and solvent based process solutions for cleaning power electronics substrates such as DCBs, IGBTs modules, discrete components on leadframes and power LEDs. These processes will ensure optimal results when performing shear tests and power cycling as well as properly prepare the substrates for any subsequent bonding and molding processes.
We offer cleaning agents for water based and solvent based cleaning processes that have been specifically designed for packages such as flip chips, CMOS, and BGAs. These products are formulated for removing flux residues after pre-balling, i.e. the solder bump reflow process, from the tight spaces and capillaries between the chip and base materials. In order to guarantee a flawless image resolution, our cleaning processes also ensure that camera modules are free of streaks and particles. With the complete removal of flux residues and particles, optimal wetting of the underfill materials can be guaranteed.