Although our 2017 Cleaning Webinar Series is over, we do have recorded sessions available. Our 2018 schedule will be released in February, and begin in late March. If there is a specific cleaning topic you are interested in, please visit our customized training page or contact academy(at)zestronusa.com.
If the reliability of your electronic assemblies is critical, removing impurities from the board’s surface as well as underneath the components is necessary. This webinar provides insight to why it is important to fully clean electronic assemblies, how electrochemical migration and leakage currents can lead to failures as well as how to avoid issues associated with white residues.
Increased densities, reduced component sizes and standoff heights as well as a large variety of component packages combine to limit the effectiveness of cleaning with DI-water. This webinar addresses cleaning agent alternatives to pure DI-water processes that will produce the required cleanliness levels and thereby guarantee the long-term reliability of assemblies.
In order to increase power module yield and reliability, companies are working on new products for power packaging especially for the common failure locations, die and substrate attach, interconnection and encapsulation. This has resulted in increased performance requirement involving greater packaging density and various material mix. This webinar provides an overview of potential failures that one can expect by selecting an inappropriate chemistry and important factors that needs to be considered while selecting an optimum cleaning agent. Several case studies will be reviewed which details on how newly improved chemical formulations provides superior material compatibility and cleanliness ensuring high reliability.
How clean is clean? When manufacturing electronic assemblies, impurities left on the board’s surface or underneath the components may lead to field failures. This webinar provides an overview of the methodologies available to properly assess the cleanliness of post-clean assemblies.
Do you conformally coat your electronic assemblies? If so, cleaning prior to conformal coating is a must to ensure the long-term reliability of your products. This webinar provides an overview of potential failure mechanisms resulting from coating over residues.
With any cleaning system, wash bath contamination accumulates over time, principally in the form of flux residues. The ability to determine accurate concentration in the presence of contamination is critical to all monitoring and control systems. This webinar presents comparative tests and field data confirming the reliability of advanced process control methodology as compared to current methods.
When implementing or upgrading a cleaning process, manufacturers have to ensure that the correct cleaning agent is chosen. There are many equipment choices available in the market depending on the throughput and production requirements. This webinar provides an overview of the modern cleaning technologies and which cleaning agent may be most suitable for a successful process. It also provides an overview of the various process options available as well as their advantages.
This webinar provides an overview of process issues related to paste and adhesive contaminated stencils, stencil cleaning technology as well as implications of cleaning nano-coated stencils. Misprint cleaning and principles of the underside wipe process will also be addressed.