DI-Water vs. Chemistry

Recent market studies suggest that water is beginning to reach its cleaning limitation, favoring the use of aqueous processes. Use of lead-free solder and low-standoff components contribute to this trend.

It is noteworthy that while most cleaning processes in the North American market rely on cleaning with deionized (DI) water only (for OA flux removal), recent market studies suggest that water is beginning to reach its cleaning limitation, favoring the use of aqueous processes. It might sound academic but even the term “aqueous” oftentimes is misunderstood or misinterpreted. Aqueous is a term that implies the use of aqueous-based chemistry; for example, an application concentration of 15% mixed with DI water. The level of active concentration actually is secondary; however, aqueous implies the addition of active ingredients. The nature of the ingredients within the aqueous product range varies between vendors and their respective chemical R&D knowledge and product technologies. These are in contrast to cleaning processes with only DI water or with a solvent, which is used at 100% concentration. A solvent does not contain water at all. After a decade of solvent-based processes dominating the precision cleaning market, the current demands are pushing toward aqueous solutions, as their cleaning window has been found to be the widest.  A number of reasons support this trend.

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ZESTRON Technical Article

DI-Water vs. Chemistry