8:30 AM - Check-in and Complimentary Breakfast
9:00 AM - Arbell: Introduction and Opening Remarks
10:15 AM - Break
11:45 AM - Complimentary Lunch & Networking
2:00 PM - Break
3:30 PM - Panel Discussion
4:00 PM - Adjourn
No clean flux technology has been in the industry for upwards of two decades, but they are not always used as part of a no-clean process. This presentation will describe the IPC classifications used to describe the properties of fluxes and the requirements that need to be met to be called a “no-clean flux.” A comparison of the benefits and drawbacks of no clean fluxes to older technology RMA fluxes and modern water soluble fluxes will be discussed. The two primary drivers for cleaning no-clean fluxes (electrochemical reliability and material compatibility) will be presented, along with tests that can be used to determine when cleaning is necessary. Finally, a review of recent research on the use of cleanliness testing as a process control for no-clean processes will be given.
About Jason Fullerton
Jason Fullerton has been with Alpha Assembly Solutions as a Customer Technical Support Engineer since 2013. He earned his Bachelor’s Degree in Manufacturing Engineering from GMI Engineering & Management Institute (now Kettering University) in Flint, MI. He has worked in manufacturing operations in the automotive, high-reliability, and commercial electronics industries, specializing in SMT and Wave Soldering processes.
Jason is a member of the SMTA and served as an officer in the Philadelphia chapter from 2011 - 2014. He is an ASQ Certified Quality Engineer, Six Sigma Black Belt, and Reliability Engineer. Jason has published and presented at a number of SMTA and IPC meetings, most recently at SMTA International 2017.
This presentation provides valuable information about contamination related failure mechanisms including Electro-Chemical Migration (ECM) and its various manifestations (dendritic growth, parasitic leakage, and CAF), coating adhesion failures, and offensive residues.
This presentation will also discuss the reasons some assemblies suffer contamination-related failures while other assemblies with identical levels of contamination remain reliable. Additional covered topics include:
About Mike Konrad
Mike Konrad is an industry expert on the removal of contamination from circuit assemblies. Mike has been in the electronic assembly cleaning industry for the past thirty one years. Mike has published scores of technical articles on the subject of cleaning and cleanliness assessment and is a member of Editorial Boards of several industry magazines. Mike is a featured speaker at industry events and technical workshops worldwide. Mike participated in the creation of IPC CH-65B "Guidelines for Cleaning of Printed Boards and Assemblies" and IPC-7526 "Stencil and Misprint Cleaning Handbook" and was also a member of the US Navy's EMPF Manufacturers Committee. Mike has been certified as an Expert Witness in civil litigation matters concerning post-reflow cleanliness assessment and contamination-related failure mechanisms. Mike is the founder of Aqueous Technologies and serves as its CEO/CTO.
Using No Clean flux and facing reliability issues? Trends within the electronics industry are increasingly moving towards miniaturized components, increased board density and reduced standoff heights, driving the need for precision cleaning regardless of the paste types used. For high reliability applications, cleaning is a requirement in order to prevent critical failure mechanisms. This presentation discusses the need to clean No Clean fluxes and will review a case study validating cleaning process parameters needed for cleaning underneath Bottom Termination Components (QFNs).
About Jigar Patel
Jigar Patel, M.S.Ch.E., is a Senior Application Engineer at ZESTRON Americas. Mr. Patel is an active member of the SMTA as well as the IPC. He has contributed to multiple case studies performed in collaboration with major cleaning equipment manufacturers. Mr. Patel provides technical support to our customers, including cleaning process recommendations as well as onsite customer support for process implementations and optimizations. He also was a key contributor to the lead-free and eutectic screening series completed at ZESTRON’s Technical and Analytical Center in Manassas, VA.
Mr. Patel graduated with a Bachelor’s Degree in Chemical Engineering from Shivaji University, India, and a Master’s Degree in Chemical Engineering from Wayne State University in Detroit, MI. He has been with ZESTRON since 2006.
The ruggedization of electronics is a complex exercise with thousands of materials to choose from in relation to various failure modes. This presentation will examine factors to be considered in selecting and applying potting, encapsulating, and coating materials for ruggedization of electronics.
About Kai Hui
Kai Hui is a graduate Commerce Graduate from the University of British Columbia with a major in Marketing and a minor in International Business. As VP of Business Development – OEM Sales (Asia) for MG Chemicals, he has been serving the electronics manufacturing industry for the past 14 years.
Kai has worked with some of the biggest names in the industry for their conformal coating needs: Samsung, LG, Lenovo, Bosch, Honda, Nissan, etc and their Tier 1 and Tier 2 suppliers.