In addition to cleaning PCBs, power modules, stencils and machine parts in automated cleaning systems, flux residues, particles, SMT adhesives and solder paste can also be removed manually. Manual cleaning is often a popular alternative if the throughput is low, i.e. when building prototypes, or during electronic component rework/repair. Manual cleaning can be performed without investing in any equipment. If a production facility with medium/high throughput, several shifts and requires excellent cleaning results, an automated cleaning process is then preferred.