When cleaning electronic assemblies with large production throughputs and minimal component diversity, implementing a spray-in-air inline system can be a time and cost saving solution. The printed circuit boards are ran on an automatic conveyor belt through individual process steps, where cleaning, rinsing and drying are performed in separate chambers.
Before deciding on an inline process, its necessary to consider the footprint. Inline machines require larger floor space in comparison to batch cleaning machines. An inline system can only be integrated into the production line when the entry and exit of the assemblies as well as the cleaning itself are fully automated.
With a spray-in-air batch system, the cleaning method operates very similarly to the technology used in a dishwasher. All of the process steps are executed in the same process chamber. The cleaning medium is sprayed onto the electronic assemblies through nozzle fittings or rotating spray arms. The cleaning effect is generally not achieved through spray jet pressure, as with inline processes, but rather via the volume of cleaning medium passed over the substrates.
This machine type for PCB assemblies is suitable for small or medium production rates and requires a smaller footprint on the production floor.