CMOS Cleaning

When manufacturing camera modules (CMOS), Flip Chip or BGA based image sensors, they are soldered onto the base substrate using a reflow process.  For the die attach process, flux pastes are used (tacky fluxes) and applied via dispensers, spray or chip dip processes.  As a result, there are two critical requirements for the cleaning process when manufacturing (CMOS):

  • The complete removal of flux residues from capillaries through optimal wetting i.e. penetration as well as rinsability of the cleaning medium
  • The complete removal of all particles from the production process

ZESTRON’s water and solvent-based cleaning media available for this application feature excellent penetration into tight spaces and rinsability.  They provide optimal flux removal enabling void-free underfill and guarantee particle and streak free glass filters of image sensors thereby ensuring flawless image resolution and preventing pixel defects.

Aqueous and Solvent Based CMOS Cleaning Agents

Cleaning agent options for CMOS cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.

pH neutral defluxing agent for semiconductor electronics

Aqueous-based, alkaline defluxing for semiconductor electronics

Aqueous-based, pH neutral defluxing agent for power modules, LEDs, leadframes, and discrete devices

Alkaline defluxing agent for PCBs and Power Electronics

Solvent-based medium for PCB flux removal


Bath monitoring
Cleaner regeneration
FAST® Technology
HYDRON® Technology
Low standoff
Maintenance cleaning
Manual cleaning
Metal cleaning
MPC® Technology
PH neutral
Power Electronics
For sensitive surfaces
Spray bottle
Stencils & Screens
Surface Analysis
Underside wiping