Component types such as FCBGA, FCmBGA, and micro-FCBGA, the electrical contacts (bumps) are soldered onto the component base utilize a combination of Flip Chip and BGA structures whereas using a reflow process. For the die attach process during Flip Chip manufacturing, flux pastes (tacky fluxes) are required and applied via a dispenser, spraying or a chip dip process. The removal of all flux residues from the tight spaces between the Flip Chip and the base material is required in order to achieve a complete and void free wetting of all materials for the underfill process.
The main requirements for the cleaning process are:
ZESTRON's aqueous and solvent-based cleaning media developed for Flip Chip processing guarantees proper underfill wetting and thereby prevent underfill voids.
Cleaning agent options for flip chip cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.