When manufacturing electronic assemblies, solder pastes, SMT adhesives or thick film pastes are printed or applied using stencils, pump print stencils or screens. Paste residues and remaining SMT adhesives on stencil surfaces and apertures can lead to misprints resulting in bridging and solder balling issues. For optimum print results, it is necessary to clean the stencils and screens either manually or using an automated stencil cleaning machine.
Cleaning agent options for stencil, screen and misprint cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.