Evaporated deposits from solder paste and solder mask can accumulate in reflow ovens during the soldering process. Regular maintenance cleaning can effectively eliminate cross-contamination and frequent solder profile adjustments.

ZESTRON recommends the use of VIGON® RC 101. Unlike IPA, VIGON® RC 101 is a water-based cleaning agent with no flash point.  When compared to IPA, VIGON® RC 101 was specifically formulated for usage on warm surfaces. This in turn reduces costly downtime even further.  A quick and efficient cleaning process is guaranteed, even for baked on flux residues.