Wave Solder Cleaning
During wave soldering, PCBs are placed on solder pallets, which in turn are held by so called “fingers”. Throughout the process most parts are being contaminated with flux residues.
The contamination build up can lead to severe quality fluctuations, especially when flux depositions on fingers interfere with the actual pallet alignment during the soldering process. Cross contamination onto PCBs through “solder flaking” has also been observed.
To effectively remove flux residues from fingers and internal areas of the wave solder equipment ZESTRON recommends the use of VIGON® RC 101. Most currently available equipment feature built-in, automated finger cleaning processes.
Compared to flammable IPA, VIGON® RC 101 is water-based, has no flash point and is even recommended to be used on warm surfaces. This in turn reduces costly downtime even further. VIGON® RC 101 has passed extensive compatibility tests and is highly recommended by leading oven manufacturers. It is also recommended for general maintenance of wave soldering equipment.
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