For the production of Flip Chip component (e.g. BGAs, PGAs, Micro-BGAs) the electronic contacts (bumps) are either dispensed or printed on the silicone wafer and subsequently reflowed.

For Die attach during Flip Chip manufacturing, flux pastes and tacky fluxes are used.  The latter are applied either via dispenser, spraying or through a dip chip process.

To achieve a complete and bubble-free wetting of the material subsequently used for the underfilling process, a cleaning process is required to remove all flux residues from the narrow gaps between the Flip Chip and the socket material.