Solder pastes, SMT adhesives as well as thickfilm pastes, which are most commonly used during the assembly process, are typically applied via screens and stencils.  Residues that remain especially in apertures can adversely impact the quality of the printing process.  In order to achieve reliable cleaning results, ZESTRON strongly recommends an automated stencil cleaning process.  This in turn, will lead to reduced misprints, a reduction of associated material costs and increased process reliability.

For every stencil and misprint cleaning application, ZESTRON offers either an MPC® Technology based product or a solvent-based cleaning solution.

With 3 state-of-the-art Technical Centers featuring over 35 cleaning processes, ZESTRON’s Global Team looks forward to support your specific stencil and misprint cleaning process.

All PCB cleaning products meet the new RoHS and WEEE guidelines, current worker safety standards and applicable environmental requirements.