ZESTRON offers cleaning solutions for semiconductor packaging applications. Cleaning applications in the semiconductor sector are often associated with chip packaging processes.

Effective defluxing is a very important prerequisite to guarantee surface cleanliness prior to wire bonding and molding.  This is especially important for High Power Packages, BGAs, and Flip Chips where solder paste and tacky fluxes are used.

In addition to BGA and flip chip cleaning, ZESTRON offers solutions for lead frame cleaning, as well as various cleaning processes associated with wafer bumping applications.