High Power Packages and devices such as MOSFETs, IGBTs, Power Hybrids and DCBs are usually clip bonded and/or wire bonded after the attach process.

Clip binding is an exception to the die attach process. The attachment is not achieved by means of adhesives or flux-free soldering, but through a lead-based soldering process. The packages are subsequently wire bonded and molded.

To create ideal conditions subsequent to wire bonding and molding processes, the integration of a cleaning step is highly recommended.