Solder pastes, SMT adhesives as well as thick film pastes, which are most commonly used during the assembly process, are typically applied via screens and stencils. Residues that are left behind, especially in apertures, can lead to subsequent print failure.

For stencil cleaning applications, ZESTRON offers either water-based MPC® products or solvent-based cleaning solutions.

When looking for a stencil cleaning process various spray-in-air as well as ultrasonic cleaning systems from leading equipment manufacturers may be considered and tested in one of our state-of-the-art Technical Centers.