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Technical Articles
Through its team of researchers and process engineers, ZESTRON’s application experiments and findings are consistently published within our electronic manufacturing community through white papers, case studies and technical articles.
The following overview presents the latest technical articles and technical papers:
- Cleaning processes
- Cleaning High-power Electronics
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent-based applications have re-emerged, and with that an overall process solution is necessary.
Published in Advanced Packaging May/June 2008 - Fluid Flow Meachanics: Key to Low Standoff Cleaning
This study was designed to investigate the impact of mechanical vs. chemical energy contributions during the removal of contamination under 1-2 mil standoff components. To validate the results obtained, extensive studies were conducted, specifically prepared test assemblies, iterative experimentation, as well as new mechanical innovations that might help users in the future. The authors included experimental data to address fluid flow mechanics, temperature and solvent concentration-related effects.
Technical paper - APEX 2008 - Eutectic & Lead-free Defluxing in One Process
Lead-free soldering has brought about several changes.
The examination of the cleaning process for lead-free has raised a critical question: Can an exisiting chemistry-based cleaning process be used to clean both eutectic and lead-free alloys in the same equipment? A study was conducted to address this question, providing users with valid technical data to better assess associated risks when using one cleaning agent for both eutectic and lead-free products.
Published in SMT Magazine May 2007 - Stencil and PCB Cleaning in a Single Process
As the demand for cleaning increases, some essential rules remain the same. For example, do not combine too many different cleaning processes into one machine using the same cleaning product.
As the North American electronics market shifts to high-reliability manufacturing, the demand for cleaning processes is increasing. One reason is that traditional production-manufacturing lines relied on no-clean assemblies, which now are becoming less reliable. Flux residues are known to change the capacitance of through-connection contact areas, affecting the signal integrity of high-density integrated and high-frequency circuits. Furthermore, inert no-clean resin layers, when exposed to climatic conditions, form dendrites.
Published in SMT Magazine September 2007 - Improved printing by understanding wipe cleaning
This case study was completed by Sanmina-SCI and illustrates how the quality of the printing process was improved by installing a new stencil underside cleaning process. The qualification for a new cleaning process was triggered by one of their key customers. The new requirements demanded a significant reduction of the number of solder balls per board. Additionally the cleaning agent had to demonstrate full compatibility with the MPM printer as well as the solder paste. As a result, IPA was replaced by a modern cleaning agent. The article presents the qualification method as well as the achieved benefits.
Published in Global SMT & Packaging 07/2006 - Fast & Cost Effective Coating Tests
Coating tests are required during development to avoid the expensive redesign of assemblies at a later point in time. Until now test methods have been time consuming and expensive. The authors investigated a fast cost effective test method, which puts conformal coating to the ultimate test.
Published in OnBoard 11/2005 - No transition problems are to be expected
By mid-2006, the RoHS (Reduction of Hazardous Substances) directive is expected to go into effect in Europe and will probably be adopted in other regions. Key in this legislative measure is the ban of large variety of heavy metals and other toxic materials in electronics products. As a result, the application of lead in solder paste will also no longer be permissible with very few exceptions. One significant question is: to which degree does the transition from SnPb alloy to the next materials change the board cleaning process?
Published in EPP Europe 03/04 - Cleaning Underneath 4 Mil Standoffs
The miniaturizing process has not reached its physical limits in the electronics industry. The increase in component complexity results in a continuous decrease in standoff spacing between the components and the substrate’s surface. This article looks at mechanical agitation cleaning systems for best cleaning results.
Published in Global SMT & Packaging 07/03 - High-Performance Assemblers Slip Back
For manufacturers of high-performance electronics, the trend has been to clean the assemblies. This article compares the technological and cost-related aspects of no-clean and clean manufacturing.
Published in EPP Europe 11-12/03 - True costs of In-Line Cleaning
The only true method of analyzing a cleaning process is to use a systems approach, which analyzes the cleaning process with regard to its four main aspects: Substrate being cleaned, contamination being removed, cleaning agent used and cleaning equipment being used.
Published in EP & P 4/03 - Cleaning Solder Frames: Solving a Costly Problem
ATRON® SP 200 is an aqueous-alkaline cleaning agent specially developed for the removal of crusted flux residues from solder frames and condensation traps
Published in EPP Europe 8/02 - Stencil Cleaning
A cleaning agent capable of removing excess solder paste, adhesives and flux residues in an automatic stencil process was developed through the described process.
Published in SMT 5/01
- Climatic reliability
- In-field Assembly failures – Expensive and Avoidable?
The interaction of cleaning with protective coating, together with peak-point analysis, all contribute to the fulfillment of long-term reliability requirements.
Published in SMT 1/03 - Lead-free and No Clean: A contradiction of Terms?
Studies in the climatic reliability of various lead-free pastes reveal an increasing threat at ambient conditions to the long-term reliability of lead-free solder joints. This article highlights the potential quality problems that can be detected and avoided.
Published in SMT 10/02 - Preventing Contamination-caused Assembly Failure
Suitable cleaning methods with effective monitoring of all processes can stem the ride of residue-induced board malfunctions.
Published in SMT 03/02 - Humidity and Pollution Effects in Electronic Equipment
The use if electronic components and sensors in humid atmosphere is on the increase. A typical example is the use in cars. This paper describes the failure mechanisms of electrochemical migration and leakage currents by corrosion.
Published: Cees Publication “Climatic and Atmospheric Pollution. Effects on Materials and Equipment”
English - Americas
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