To provide the required evidence of cleanliness, coatability and bondability, ZESTRON's Analytical Center features over 20 specifically designed test methods in accordance with the latest cleanliness standards.

Adequate cleanliness level assessments of your electronic assemblies can be performed with techniques ranging from the ZESTRON Flux and Resin Test, to surface tension analysis, SIR and Ion Chromatography, respectively.

Assembly surface analysis prior to coatability or bondability can be completed using contact angle measurement methods as well as the ZESTRON Ink Test.  For failure analysis assessments of electronic assemblies, methods such as the Water Stress Test and copper related surface deficiencies are readily available.

To inquire about our analytical test methods, please contact our Engineering Team directly.