Aqueous-based cleaning medium for defluxing

HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentrations (3% to 5%), the cleaning agent has been specifically developed to penetrate the capillary spaces underneath low standoff components, where DI-water only applications can no longer provide reliable cleanliness levels.

Advantages compared to other cleaners:

  • Facilitates the fast removal of a wide variety of the latest water-soluble (OA) flux residues, both leaded and lead-free
  • Non-foaming formula eliminates formation of “white scaling”
  • Excellent compatibility with sensitive metals and metal coatings
  • Gentle formulation leaves solder joints and pads shiny and bright
  • Ethanolamine-free
  • Halogen-free formulation
  • Low odor
DOWNLOAD HYDRON® WS 400 TECHNICAL INFORMATION