Manassas, VA – September 21, 2015 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Ravi Parthasarathy, Senior Process Engineer, ZESTRON, will present “Impact of Cleaning Technologies on Lead Frame Packages: The Difference in Wire Bond Yields” at IMAPS’s Advances in Semiconductor Packaging Exhibition on September 24th.
Leadframe packages are widely used for semiconductor device fabrication. Typically, the interconnections between an integrated circuit (IC) and the metal leads are made through the process of die attach and wire bonding. For die attach processes, the standard materials used are epoxy, adhesive or solder paste. Prior to wire bonding and molding processes, it is critical to remove post-solder flux residues in order to maximize overall yield. For companies that are manufacturing semiconductor devices, it is common to produce millions of units per day. As a result, incremental improvement in wire bond yield by a fraction of a percent can significantly impact production efficiency and the final product cost model.
This presentation reviews a design of experiment that was developed to improve a semicon manufacturer’s cleaning process and the resulting wire bond yield.
IMAPS’s Advances in Semiconductor Packaging will be held at SUNY Polytechnic Institute on Thursday, September 24th from 8:00 AM to 5:00 PM. For more information on ZESTRON’s product lines, services, and learning opportunities, please visit our booth.