Particles on an electronic assembly’s surface can impair the functionality of the assembly and therefore also the functionality of the product. Especially in the presence of conductive and hygroscopic particles in combination with humidity the risk for failures rises. As gaps between contact areas are getting smaller and power densities increase, technical cleanliness gets into the focus.
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|Date:||29th May 2019|
|Time:||3.30 - 4.15 pm (CET)|