Similar to the subsequent processing of Flip Chip components, when manufacturing CMOS, Flip Chip or BGA-based image sensors are soldered onto the base substrate using a reflow process. For the die attach process, flux pastes are used (tacky fluxes) and applied via dispensers, spray or chip dip processes.
As a result, there are two main requirements for the cleaning process when manufacturing camera modules (CMOS):
ZESTRON’s water and solvent based cleaning media available for this particular application feature excellent penetration into tight spaces and rinseability. On the one hand, they can provide optimal flux removal and thus a void-free underfill and on the other hand, they guarantee particle and streak free glass filters of image sensors in order to ensure a flawless image resolution and avoid pixel defects.