Modern, water-free printed circuit board cleaning processes are primarily run in single chamber solvent machines with vapor rinse but sometimes also in multi-chamber dip tank processes. The cleaning methodologies used are ultrasonic and spray-under-immersion.
A solvent-based cleaning step is typical in water-free processes. Subsequently, one or several rinsing steps with the same solvent take place.
For these types of processes, the cleaning chemistries are modern solvent-based cleaners with broad spectrum formulations. The polar and non-polar components of the cleaning agents are able to remove a wide variety of flux residues from leaded and lead-free no-clean solder pastes. Furthermore, solvent-based cleaners can be easily distilled, enabling them to be used in cleaning equipment with vapor rinse. Due to their surfactant free formulation, they dry fast and residue free.
Please contact our Application Technology department to find the optimal cleaning process for your application!