Productronica 2025
18/11/2025
Reliability up - Cost down
ZESTRON @Productronica – 18. - 21.11.2025 – Munich
If any of the below topics is a concern for you, chat with us in Hall A2/343
- Improve Mold Adhesion – even without cleaning, interfaces of Power Modules can be significantly improved within your manufacturing processes
- Yield Increase – we help you to increase your Power Module yield and significantly reduce cost of quality.
- Humidity Robustness – achieve strictly Mission profile based assemblies to ensure humidity robustness at lowest manufacturing cost possible
- Cleaning Process Evaluation – find your cleaning process fast, including machine, chemistry & process monitoring for your specific needs.
- PCBA Defluxing – worlds’ leading chemistry for PCBA defluxing meeting any international standard and ensure your PCBA cleanliness requirements are met
- Failure Analysis – No matter if field or qualification failures: We assist to find root causes fast and help identify targeted preventive measures
- Particle Risk Assessment – Very fast, we give you an indication, if the particle load on your component will become electrically active/critical in the field
Our experts are ready to talk to you.
Easy to find: Hall A2-343