Analytic Services

Visual Inspection

cleanliness electronic assembly

Post solder flux residues remaining on electronic assembly surfaces can adversely affect their functional reliability as a result of electrochemical migration, dendritic growth and leakage current. Thus, it is critical to remove these residues in order to ensure the highest level of product reliability. A simple and fast conductable method of assessing surface cleanliness of an electronic assembly is visual inspection analysis. This is a non-destructive cleanliness assessment method defined within IPC standards.


This service includes

  • High resolution surface analysis of electronic assemblies by using optical (80x) and digital (up to 1000x) microscopes
  • Comprehensive technical report of the analysis results including photos and process recommendations