Analytic Services

Visual Inspection

cleanliness electronic assembly

Post solder flux residues remaining on electronic assembly surfaces can adversely affect their functional reliability as a result of electrochemical migration, dendritic growth and leakage current. Thus, it is critical to remove these residues in order to ensure the highest level of product reliability. A simple and fast conductable method of assessing surface cleanliness of an electronic assembly is visual inspection analysis. This is a non-destructive cleanliness assessment method defined within IPC standards.

This service, conducted in ZESTRON’s technical centers, includes:

  • High resolution surface analysis of electronic assemblies by using optical (80x) and digital (up to 1000x) microscopes
  • Comprehensive technical report of the analysis results including photos and process recommendations

Should you have further questions about this service, please contact techsupport(at) We are looking forward to send you an offer: info(at)

Contact us

cleanliness electronic assembly

Phone: +49 (841) 635-26