ZESTRON® SW

Cleaning agent for stencil underside wiping in SMT printers

Contact

Zestron Europe building.
Your Contact

ZESTRON EUROPE

Phone

+49 (0) 8453 / 41995318

Find your local sales and distribution partner

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Your Benefits ZESTRON® SW

Solvent-based cleaner with a high flash point, which was developed together with leading SMT printer manufacturers and specifically designed for the use in SMT printers without vacuum drying. The cleaning achieves reproducible, safe cleaning results.

  • Reliable removal of solder paste
    Due to its wide process window, the cleaning agent reliably removes common solder pastes from the stencil underside. It reduces the amount of cleaning cycles, due to its good cleaning performance.
  • Fast and residue-free drying
    Dries fast and residue-free on stencils after dry wipe. This increases the reliability of the printing process.
  • Good delineation stability
    The cleaning agent has a good delineation stability and thus reduced solder balling.
  • High flash point, high operational safety
    Unlike Isopropanol (flash point: 12°C/54°F) the product (flash point: 67°C/153°F) dramatically increases operational safety while operating stencil printing equipment.
  • Approved by leading international manufacturers
    The cleaning agent has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained.

Product features

Underside wiping

Solvent