VIGON RC 101

Based on the MPC^® Technology, VIGON^® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies. 

Advantages compared to other cleaners:

• Has no flash point and therefore can be applied directly onto cold or warm surfaces (30 - 40 °C / 86 - 104 °F)
• The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts
• Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided