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Electrochemical migration - origin and prevention of field failures / Part II

Electrochemical migration is an important topic for the reliability and durability of electronic assemblies, and is frequently discussed as the cause of malfunctions in the field.

Electrochemical migration is an important topic for the reliability and durability of electronic assemblies, and is frequently discussed as the cause of malfunctions in the field. 

In the first part of this article, which appeared in the September 2016 issue of SMT Today, the preconditions for the development of electrochemical migration (ECM) were explained, the development mechanism was examined in detail and the distinction between ECM and other dendrite failures and their consequences was shown.

The main focus in the following will be on how to prevent ECM in order to avoid the resulting field failures. Four different approaches for preventing ECM will be presented.