ZESTRON Academy is pleased to invite production operators, managers and process engineers to participate in our FREE Cleaning Webinar Series. All webinars begin at 1:30 PM EDT, with a 45 minute presentation and 15 minute Q&A. If there is a specific cleaning topic you are interested in, please visit our customized training page.
Should You Clean PCBs? - March 26th
At ZESTRON, we understand that FAILURE IS NOT AN OPTION! Successfully removing impurities from a printed circuit board’s surface and underneath its components is critically important to ensuring the reliability of electronic assemblies. Join ZESTRON Academy in exploring the benefits of fully cleaning PCBs and how potential sources of board failure such as electrochemical migration, leakage currents, and white residues can be mitigated.
Cleaning Before Conformal Coating - April 23rd
Join ZESTRON Academy for an in-depth discussion on the properties of conformal coating, surface cleanliness assessment methods prior to conformal coating, and long-term reliability testing after conformal coating. We will be examining how coating over residues can result in product failures and share expert process recommendations so that you can prevent it from happening to you.
Cleaning With pH Neutral Chemistry - May 28th
Please join ZESTRON Academy for a comprehensive overview of pH neutral cleaning agent development coupled with performance reviews of pH neutral cleaning agents. Given the greater use of lead-free solder paste and the required higher reflow profiles, it’s now more difficult to remove burnt-on flux residues. With increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. Discover how newly developed pH neutral formulations have proven to be capable not only of removing these difficult post-reflow residues, but do so without affecting the material compatibility of sensitive components.
Jet Printing Solder Paste and Cleaning Challenges - June 18th
Manufacturers in today’s production environment are overcoming printing challenges by incorporating jet printing as an additional add-on step to add extra solder paste volume when needed. With that comes cleaning challenges, as jet printed solder pastes have proven to be more difficult to clean as compared to screen printed pastes. Join ZESTRON Academy as we address the reasons for the increased cleaning challenge with comparative cleaning trial data and customer case study reviews.
Surface Cleanliness Assessment - July 23rd
Have you wondered, how clean is clean? Join the experts at ZESTRON Academy in answering that question. Impurities left on a board’s surface or underneath components may lead to field failures. Join us for a comprehensive examination of the tools and methods available to properly assess the cleanliness of assemblies after the cleaning process.
Defluxing Advanced Packages - August 27th
Through a series of case studies, please join ZESTRON Academy for a look at complex component packages that are increasingly being used in the industry and the failure mechanisms associated with them. We will also examine the factors that affect cleaning and the typical cleaning processes that are available in the industry. With increasing packaging density and the introduction of new materials, join us as we discuss overcoming present day challenges from Class III Assemblies.
Solder Mask & Low Stand-Off Component Cleaning - A Connection? - September 17th
The solder mask is necessary for long term reliability of PCBs, but can it’s presence also impact cleaning process effectiveness? Please join ZESTRON Academy in exploring the impact of different solder mask options on under component cleanliness. This informative and exploratory presentation will cover a myriad of key takeaways and findings from this newly completed study.
Multiple Thermal Cycles - October 29th
Please join ZESTRON Academy as we thoroughly examine the impact of multiple thermal cycles on the effectiveness of the PCB cleaning process. Today, multiple thermal cycles may be required for a variety of reasons in the production of printed circuit boards. This can include the presence of Surface Mount Technology (SMT) and Through Hole Technology (THT), stacked components and double-sided circuitry. With the potential for multiple reflows, it is more important than ever to have a cleaning process that is optimized for it.