Power Electronics Cleaning
ZESTRON offers aqueous and solvent based process solutions for cleaning power electronics such as DCBs, IGBTs, discrete components on leadframes, and Power LEDs. These processes ensure that optimal results are achieved when performing shear and power cycling tests and that the substrates are fully cleaned prior to the subsequent bonding and molding processes.
These processes ensure that optimal results are achieved when performing shear and power cycling tests and that the substrates are fully cleaned prior to the subsequent bonding and molding processes.
Package Cleaning
ZESTRON offers cleaning agents for water and solvent-based cleaning processes that have been specifically designed for packages such as flip chips, CMOS and BGAs. These products are formulated for removing flux residues after pre-balling, i.e. the solder bump reflow process, from the tight spaces and capillaries between the chip and base materials. Our cleaning processes ensure that CMOS sensors are free of streaks and particles thereby guaranteeing flawless image resolution. With the complete removal of flux residues and particles, optimal wetting of the underfill materials can be guaranteed.
Water and Solvent Based Semiconductor Cleaning Agents
Cleaning agent options for semiconductor cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.
Legend
