During the balling process of BGAs and micro BGAs, the external connections are formed at the base. Normally, solder spheres are soldered onto the bottom of the package using a tacky flux. Flux residues need to be fully removed. If partially cleaned, they can lead to component failure through electrochemical migration and corrosion-induced leakage currents.
Cleaning agent options for BGA cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.