When manufacturing camera modules (CMOS), Flip Chip or BGA based image sensors, they are soldered onto the base substrate using a reflow process. For the die attach process, flux pastes are used (tacky fluxes) and applied via dispensers, spray or chip dip processes. As a result, there are two critical requirements for the cleaning process when manufacturing (CMOS):
ZESTRON’s water and solvent-based cleaning media available for this application feature excellent penetration into tight spaces and rinsability. They provide optimal flux removal enabling void-free underfill and guarantee particle and streak free glass filters of image sensors thereby ensuring flawless image resolution and preventing pixel defects.
Cleaning agent options for CMOS cleaning applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.