When manufacturing camera modules (CMOS), Flip Chip or BGA based image sensors, they are soldered onto the base substrate using a reflow process.  For the die attach process, flux pastes are used (tacky fluxes) and applied via dispensers, spray or chip dip processes.  As a result, there are two critical requirements for the cleaning process when manufacturing (CMOS):

• The complete removal of flux residues from capillaries through optimal wetting i.e. penetration as well as rinsability of the cleaning medium
• The complete removal of all particles from the production process

ZESTRON’s water and solvent-based cleaning media available for this application feature excellent penetration into tight spaces and rinsability.  They provide optimal flux removal enabling void-free underfill and guarantee particle and streak free glass filters of image sensors thereby ensuring flawless image resolution and preventing pixel defects.