When manufacturing Power LEDs, cleaning is required following wire bonding and the die attach process to ensure optimum bond strengths and yields, surface activation as well as provide an improved bond between the die and substrate.
If flux residues and specifically flux spatter from the soldering process on the chip surfaces are not completely removed, it can lead to unfavorable bonding conditions. These often result in heel cracks and even chip defects due to unnecessary high bonding power. Poor bond strengths and low yields are often due to process contamination.
A cleaning process using aqueous-based cleaning agents or modern solvents that has been specifically developed for power LEDs increases wire bond strength and enhances heat transfer in die attach guaranteeing higher yields.
Optimally cleaned LEDs offer not only a higher light conversion, higher luminosity and color fastness but also extends product life.
Our engineered cleaning agents as well as the respective cleaning equipment provided by leading international manufacturers can be tested at a ZESTRON Technical Center under production floor conditions.
Cleaning agent options for Power LED applications are detailed below. All ZESTRON cleaning agents are in compliance with the latest RoHS, REACH, and WEEE regulations worldwide in addition to current worker safety standards and applicable environmental requirements.